X4-9070 is a fifth generation TLC 3D NAND flash chip from YMTC (Yangtze Memory Technologies) based on Xtacking 4.0 architecture, 232-layer 3D TLC (3 bits per cell) with 1 Tb (128 GB) per die density, I/O speed up to 3600 MT/s (ONFI 5.1) and optimized power consumption, designed for high-performance SSDs (e.g., Zhitai TiPro 9000, PC450) enterprise/consumer/embedded systems, providing high density, performance and compatibility with previous generations of TLC chips.
1.Architecture and performance
· Technology: 3D TLC (3 bits per cell), Xtacking 4.0 with BSSC (Backside Source Connect), 6-Plane (2×3) with Center X-DEC (central decoder), 232 active layers (total 294-level 3D structure), 20-hole vertical channel design.
· Density: 1 Tb (128 GB) per die, 18.7 Gb/mm², 36% higher than previous X3-9070 (14 Gb/mm²).
· I/O speed: up to 3600 MT/s (ONFI 5.1), 50% higher than X3-9070 (2400 MT/s), support for ONFI/Toggle DDR, compatibility with X3-9070.
· Performance: 6-Plane vs 4-Plane — performance 50% higher, power consumption 30% lower than X3-9070, support for SLC cache (up to 1/4 of capacity) for improved random operations.
2.Energy efficiency and reliability
· Power consumption: optimized via Xtacking 4.0, support for DevSleep, ASPM, HMB, power consumption 30% lower than X3-9070.
· Reliability: support for ECC (BCH + LDPC), S.M.A.R.T., TBW (up to 600 TB per 1 TB SSD, e.g., TiPro 9000), temperature range 0–70 °C (client) / -40–85 °C (embedded/enterprise), RoHS/JEDEC compliant.
· Production: 294-level 3D NAND, 232 active layers, mass production since 2025, compatibility with PCIe 4.0/5.0 controllers (NVMe 2.0).
3.Application area
· SSD: Enterprise (for cloud services, big data), consumer (Zhitai TiPro 9000, PCIe 4.0/5.0 NVMe SSD), embedded (eMMC/UFS for mobile devices, IoT).
· Applications: 4K video editing, 3D rendering, gaming, cloud computing, high-performance client systems.
