Overview of the YMTC X3‑9070 Flash Chip (Fourth Generation TLC 3D NAND)

Key Features and Characteristics

1. Architecture and Performance
   • Technology: Xtacking 3.0 with BSSC (Backside Source Connect), 6‑Plane (2×3) with Center X‑DEC (central decoder), 232 active layers, 294‑level 3D NAND.
   • Density: 1 Tb (128 GB) per die, 16 Gb/mm², 100% higher than the previous X2‑9060.
   • I/O Speed: up to 2400 MT/s (ONFI 5.0), 50% higher than X2‑9060, supports ONFI/Toggle DDR, compatible with X2‑9060.
   • Performance: 6‑Plane vs 4‑Plane — 50% higher performance, 25% lower power consumption, WL capacity cut in half, RC latency reduced by 15‑20%.
2. Energy Efficiency and Reliability
   • Power Consumption: optimized thanks to BSSC and 6‑Plane, supports DevSleep, ASPM, HMB, SLC cache.
   • Reliability: supports ECC, S.M.A.R.T., TBW (up to 1200 TB for the 2 TB TiPlus 7100 SSD), temperature range 0‑70 °C (client) / -40‑85 °C (embedded/enterprise).
   • Production: mass production since 2022, 232‑layer 3D NAND, 294‑layer vertical design.
3. Applications
   • SSDs: client (Zhitai TiPlus 7100, Colorful CN700, KingBank KP260 Plus), enterprise/OEM (PC450), PCIe 4.0 x4 (NVMe 2.0).
   • Use cases: 4K video editing, 3D rendering, gaming, cloud computing, big data, IoT, mobile devices.