X4-6080 is a fifth generation QLC 3D NAND flash chip from YMTC (Yangtze Memory Technologies) based on Xtacking 4.0 architecture, 232-layer 3D QLC (4 bits per cell) with maximum density of 2 Tb (256 GB) per die, I/O speed up to 3600 MT/s (ONFI 5.1) and optimized power consumption, designed for high-capacity SSDs (e.g., Zhitai Ti600 Pro, PC42Q) enterprise/consumer/embedded systems, providing record density, performance and compatibility with previous generations of QLC chips.
1.Architecture and performance
· Technology: 3D QLC (4 bits per cell), Xtacking 4.0 with BSSC (Backside Source Connect), 232 active layers, 6-Plane (2×3) with Center X-DEC (central decoder), 20-hole vertical channel design.
· Density: 2 Tb (256 GB) per die, 20 Gb/mm², 100% higher than previous X3-6070 (1 Tb), leader among production QLC chips.
· I/O speed: up to 3600 MT/s (ONFI 5.1), 50% higher than X3-6070 (2400 MT/s), support for ONFI/Toggle DDR, compatibility with X3-6070.
· Performance: 6-Plane vs 4-Plane — performance 50% higher, power consumption 30% lower than X3-6070, support for SLC cache (up to 1/8 of capacity) for improved random operations.
2.Energy efficiency and reliability
· Power consumption: optimized power consumption at high performance, support for DevSleep, ASPM and other power saving technologies.
· Reliability: support for ECC (BCH + LDPC), S.M.A.R.T., TBW (up to 300 TB per 1 TB SSD, e.g., PC42Q), temperature range 0–70 °C (client) / -40–85 °C (embedded/enterprise), RoHS/JEDEC compliant.
· Production: 294-level 3D NAND, 232 active layers, mass production since 2025, compatibility with PCIe 4.0/5.0 controllers (NVMe 2.0).
3.Application area
· SSD: Enterprise (for cloud services, big data), consumer (Zhitai Ti600 Pro, PCIe 4.0 PC42Q), embedded (eMMC/UFS for mobile devices, IoT).
· Applications: archival storage, large databases, virtualization, content streaming, high-capacity client systems with limited budget.
