Brief description of YMTC flash chip X2-9060 (third generation TLC 3D NAND)
X2-9060 is a third generation TLC 3D NAND flash chip from YMTC based on Xtacking 2.0 architecture, 128-layer 3D TLC (3 bits per cell), 512 Gb (64 GB) per die, 8.30 Gb/mm² density, I/O up to 1.6 GT/s (ONFI 4.1), 4-Plane with 2×2 architecture, designed for PCIe 3.0 NVMe SSDs (e.g., Zhitai PC005/PC210, Colorful CN600), enterprise/consumer/embedded systems, now discontinued (replaced by X3-9070).
Key features and characteristics
1.Architecture and performance
· Technology: Xtacking 2.0 (logic/cells separate), 4-Plane, 128 active layers, 164-level 3D structure, 3D TLC (3 bits/cell).
· Density: 512 Gb (64 GB) per die, 8.30 Gb/mm², 164-level 3D NAND.
· I/O speed: 1.6 GT/s (ONFI 4.1, Toggle DDR), 1.2V power supply, support for SLC cache (up to 1/4 of capacity).
· Performance: 4-Plane, 1.6 GT/s — sufficient for PCIe 3.0 NVMe SSDs (up to 3.5 GB/s sequential read), with DRAM-less controller (e.g., Maxio MAP1202).
2.Energy efficiency and reliability
· Power consumption: optimized via Xtacking 2.0, support for DevSleep, ASPM, HMB, 25% lower than previous generation TLC chips.
· Reliability: ECC (BCH + LDPC), S.M.A.R.T., TBW 700 TB per 1 TB SSD (Zhitai PC005), temperature range 0–70 °C (client) / -40–85 °C (embedded), RoHS/JEDEC compliant.
· Production: 128-layer 3D TLC, mass production 2020–2023, replaced by X3-9070 (176/232 layers).
3.Application area
· SSD: Consumer (Zhitai PC005/PC210, Colorful CN600), enterprise (embedded server SSDs), embedded (eMMC/UFS for mobile/IoT).
· Applications: Personal PCs, cloud computing, big data, mobile devices, embedded systems with moderate performance requirements.