· Technology: GDDR5 SGRAM, 16 internal banks (4 bank groups), 8-bit prefetch, burst length (BL) = 8.
· Configuration: 256M×32 I/O, total capacity 8 Gb (1 GB).
· I/O speed: 8.0 Gbps per pin (clock frequency 4000 MHz), total chip bandwidth — 32 GB/s.
· Latencies: CAS latency 7–24 (programmable), WRITE latency 4–7 (programmable), tCCD_L = 3 tCK.

· Power: VDD = VDDQ = 1.5 V ±3% (optional 1.35 V for reduced power consumption).
· Consumption: optimized for sustained graphics workloads, support for power-saving modes.
· Reliability: support for ECC for error correction, RoHS compliant.
· Temperature range: 0–85 °C (commercial operating mode).
· Form factor: 170-pin FBGA (size 12.0×14.0 mm), surface mount.

· Graphics cards: mid-range gaming adapters with PCIe 3.0/4.0, targeting 1080p/1440p resolution.
· Workstations: devices for graphic design, Full HD video editing, and basic 3D rendering.
· Embedded systems: industrial graphics controllers, network chips with graphics acceleration.